SK Hynix selects investment banks for U.S. listing – Korean Economic Daily
SK Hynix 000660.KS has chosen Citigroup C.N, JPMorgan JPM.N, Goldman Sachs GS.N, and Bank of America BAC.N as underwriters for its U.S. initial public offering, the Korean Economic Daily reported Friday.
Last month, the South Korean chipmaker declared a confidential filing to list its shares on the U.S. market in the second half of 2026. SK Group President Chey Tae-won said the U.S. listing could expand SK Hynix’s shareholder base beyond Korea, increasing exposure to U.S. and international investors and strengthening its global presence.
Here are some details:
- The U.S. listing is expected to raise between 10,000 and 15,000 billion won (6.63 billion to 9.95 billion dollars) to fund AI infrastructure, including the development of the company’s Yongin chip cluster.
- Reuters previously reported that the U.S. listing could raise up to $14 billion to fund chip manufacturing plants in Yongin, South Korea, and Indiana, USA.
- The South Korean company’s U.S. listing could be more than double the 2021 U.S. IPO of e-commerce group Coupang CPNG.N for $4.6 billion.
- SK Hynix stated, “We cannot confirm at this time as the process is still in a preliminary stage, and as the selection of underwriters is yet to come, we cannot say more.”
- Citi declined to comment. JPMorgan, Goldman Sachs, and Bank of America were not immediately available for comment outside of business hours.
- SK Hynix shares were up 5.8% in early trading, compared to the 2.7% rise of the KOSPI index .KS11.
(1 $ = 1,509.1000 won)
((Automated translation by Reuters using machine learning and generative AI, please refer to the following disclaimer: https://bit.ly/rtrsauto))
